Title: Revolutionizing Traction Inverters: Advances in High-Power Module Packaging for Electric Vehicles
Abstract: Power modules are pivotal in electric vehicles, where packaging impacts performance, reliability, and lifespan. Wide bandgap (WBG) semiconductors like Silicon Carbide (SiC) and Gallium Nitride (GaN) enable higher temperatures, frequencies, and efficiencies compared to silicon. Recent innovations, including molded modules and double-sided cooling, enhance flexibility and thermal performance. Robust topside interconnections and advanced die-attach technologies like copper sintering address the increasingly challenging high-power demands. Embedding semiconductor devices into printed circuit boards (PCBs) reduces size and improves efficiency by minimizing resistance and inductance.
Biography: Dr. Achim Strass received his Diploma in Physics from the Technical University of Munich in 1994 and earned his PhD (Dr.-Ing.) in Silicon Process Technology from the Bundeswehr University Munich in 1998. He began his career at Siemens (now Infineon Technologies), where he successfully led several global semiconductor equipment and software harmonization projects.
In 2004, Dr. Strass played a key role in establishing Qimonda’s assembly and test operations in Suzhou, China, setting up both, failure analysis and yield management capabilities. Returning to Germany, he pioneered the industry’s first replacement of gold with copper wire in high-integration, low-power automotive packages as an overall project leader. Dr. Strass then returned to Asia to found the High-Power Center Automotive at Infineon Korea, where he earned the prestigious High-Performance Award for securing a significant customer project with his team, focused on vehicle electrification with innovative high-power modules that were new to the industry.
In 2017, he joined Huawei in the greater Munich area as a Technical Director, tasked with building a large-scale, modern manufacturing technology center from scratch. He was responsible for the whole R&D dedicated a.o. to advancing new high-power electronics technologies. A short time later, he was appointed Director of the Advanced Power Electronics Technical Management Group at the corporate level. Since 2022, Dr. Strass has served as the head of worldwide technology scouting and cooperation at Nexperia, leveraging his extensive network to connect this young company with global semiconductor ecosystems. He is a member of Nexperia’s R&D Leadership Team and contributes to several internal and external top management boards.